World Equipment & Machine Sales Company is now celebrating our 29th year, with our offices and warehouse in Solon, OH U.S.A. we are your one-stop resource for evaluating, appraising, buying, marketing, and selling used foundry assets around the World.
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EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry's first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use ...
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The degree of difficulty of doing this "sand core debonding" depends upon the geometry of the part being cast. There are a number of binder systems used for the bonding of foundry sand into sand molds and sand cores, the major ones being identified in the trades by the following nomenclature: Furna No-Bake. Phenolic Urethane Cold Box
Foundry Metallurgy of Tungsten Carbide and Aluminium Silicate Particulate Reinforced LM6 Alloy Hybrid Composites ISSN: 2180-1053 Vol. 3 No. 1 January-June 2011 57 On a weight adjusted basis, many aluminium and aluminium alloy based composite materials can outperform the conventional ferrous
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From the scrap yard to shipping, General Kinematics foundry equipment has a solution to improve your foundry flow and productivity… With the largest selection of vibratory and rotary foundry machinery equipment available in the industry, GK can create process flow improvements that will show real value to your throughput and bottom line.
The "Electrical Equipment" means any equipment designed for use with a voltage rating of between 50 and 1000 V for alternating current (A.C.) and between 75 and 1500 V for direct current (D.C.). Therefore, it is called often "Low Voltage Electrical Equipment" which includes the vast majority of electrical equipment in everyday use. more >>
Over the last year, leading-edge silicon foundries announced their new and respective strategies in the emerging 2.5D/3D chip arena. The ink is barely dry and now the foundry landscape is changing. One new vendor, Tezzaron Semiconductor, is entering the market. The 3D DRAM supplier plans to provide ...
Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology and medical device markets.
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Dec 20, 2011· EVG's temporary bonding and debonding systems are modular, so that if the hand off point is determined to be after temporary bond before debond, the temporary bonding system can live, for example, at the foundry while the debond system lives at the OSAT, theoretically not adding to the cost of ownership (CoO).
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Sand cores are removed from metal or plastic coatings by exposing the cores to a humid atmosphere for a sufficient time to weaken the binder of the sand cores....
The supplier of new, used and rebuilt equipment for the foundry industry. We can also design complete foundries from drawing to start-up. Our warehouse holds over 50,000 square feet of reusable foundry equipment like mullers, mixers, ladles, molding machines, air hoists, gear boxes, shot blasts, furnaces, permanent mold machinery, lab equipment, grinders and dust collectors.
Aluminum Foundry Sand Core De-bonding Description. Images. ... Procedyne offers a full range of metallurgical heat treatments using patented Fluidized Bed Equipment and Processes. Our simple-to-operate and rugged equipment can be used for surface and through hardening treatments.
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Jan 31, 2019· Various kinds of debonding methods are utilized, including thermal release, solvent removal, laser assisted, and mechanical debonding. Most current temporary bonding/debonding materials required release layers that are either laser sensitive for laser-irradiation release and/or adhesion control between glue and substrate boundary.
Production Equipment FPD Production Equipment FPD Coater/Developer FPD Plasma Etch/Ash System ... Foundry OSAT Package -FOWLP/PSP ATS BU Business Domain . M. Yamamoto / TEL 3DI Dept. / 2015 11 ... • In mechanical debonding process, debonding force control is important. • TEL can provide the best solution for HVM.
Mar 20, 2019· EV Group (EVG), a supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry's first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for …
May 21, 2014· COMPLETE FOUNDRY LIQUIDATION Featuring: Foundry Equipment (Supplier to Transportation & Industrial Markets) Auction starts at 10AM local time. Register 24 hours prior to start of auction. MUST HAVE DEPOSIT OR BANK LETTER OF GUARANTEE TO BID.
foundry equipment (24) HUTCHINSON Shell Core Machines, Allen Bradley Panelview 300 Controls, Allen Bradley PowerFlex 700 AC Drives, Sand Delivery Hopper/Loader, Shalco or Shell Process Debonding Presses
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